With projection exposure without mask damage, and expansion in response to the shrinkage of the substrate, it is possible to achieve high-precision overlap of multi-layer types. A step-and-repeat exposure machine for high-density printed circuit boards that achieves 10μ line width/line spacing, and 1.5 seconds of exposure between tacts.

feature:

Maintain overlap accuracy even if the substrate shrinks

For each exposure area, high-precision correction is performed. In addition, the "automatic measurement function" that automatically zooms according to the type of expansion Max 0.1% is used to correct the projection magnification, which greatly reduces the correction deviation caused by the shrinkage of the substrate.

Special TTL non-exposure wavelength 4 camera team alignment method

Using USHIO technology "TTL non-exposure wavelength correction", when observing the mask mark, the exposure will not reach the substrate correction mark. In addition, the work mark can be directly observed, and the brightness is not reduced due to the mask, so it is possible to perform high-precision correction from the clear mark.

Suitable for all kinds of calibration work

It has a "type comparison function" suitable for storage types, and calibration of various wiring types can be performed without using calibration marks.

High resolution capability:

Equipped with USHIO's projection lens "UPL series" to achieve high resolution capabilities. It is suitable for formal mass production of design specifications of 10μ lines/space.

Deeper focus/point/depth/degree

Even if the focus/point depth/degree/deepness (±50～100μm) causes the height difference or bending of the substrate, or the image offset caused by slack, the same type profile view as the correct focus/point can be obtained. Especially thick film dry glue film, or resist exposure is more effective.

High-speed stepping and repeating through the surface stage

The use of precision air bearings eliminates friction, and the surface motor structure achieves lightweight and high rigidity of the movable part, realizing high-speed stepping and repetitive motion. In addition, the surface stage implements the feedback control of the laser interference meter, and achieves high-speed action and high position determination accuracy at the same time.

No damage to the mask

The non-contact projection exposure method of the mask and work is adopted, so the mask will not be damaged due to the adhesion of resists. Not only can prevent/stop wiring type defects, the use of the photomask can be semi-permanent/long-term, reducing operating costs. In addition, the photomask does not require cleaning and maintenance. Compared with the close-fitting exposure device machinery, it can also improve the operation rate of the equipment.

The main purpose:

Exposure of build-up printed circuit boards

Multi-layer type overlap exposure

Package (PKG)

Hostage

Electronic parts

Wiring and processing, etc.